PCB Capabilities

Layer count

Manufacturing Capabilities: 1 – 32 layers

Notes: Quantity of copper layers on the board

Impedance

Manufacturing Capabilities: For 4, 6, 8, 10, 12, 14, 16, 18, 20 layer PCBs, stackup designed by NextPCB (by default), or stackup designed by customers

Notes: Layer stackup structure impedance calculation parameter

Impedance tolerance

Manufacturing Capabilities: ±10%

Material

Manufacturing Capabilities: FR-4

Notes: FR-4: TG130 / TG150 / TG170

PCB material dielectric constant

Manufacturing Capabilities: 4.2

Notes: Prepreg dielectric constant (prepreg type: 7628 / 1080 / 2313 / 2116, dielectric constant: 4.2)

Max. dimension

Manufacturing Capabilities: 1–2 layers: 500×600mm; 4–20 layers: 400×500mm

Notes: The maximum dimension that NextPCB can manufacture

Min. dimension

Manufacturing Capabilities: Length and width ≥10mm

Notes: Min. dimension = 10×10mm

Dimension tolerance

Manufacturing Capabilities: CNC: ±0.15mm, V-CUT: ±0.2mm

Notes: ±0.15mm for CNC routing, and ±0.2mm for V-scoring

PCB thickness

Manufacturing Capabilities: 0.6 / 0.8 / 1.0 / 1.2 / 1.6 / 2.0 / 2.5 / 3.0 / 3.2mm

Notes: The thickness of finished board

Thickness tolerance (Thickness ≥ 1.0mm)

Manufacturing Capabilities: ±10%

Notes: e.g. if board thickness is 1.6mm, the finished thickness ranges from 1.44mm (1.6−1.6×10%) to 1.76mm (1.6+1.6×10%)

Thickness tolerance (Thickness < 1.0mm)

Manufacturing Capabilities: ±0.1mm

Notes: e.g. if board thickness is 0.8mm, the finished thickness ranges from 0.7mm (0.8−0.1) to 0.9mm (0.8+0.1)

Finished copper weight (outer layer)

Manufacturing Capabilities: 1oz / 2oz

Notes: Finished copper weight of outer layer could be 1oz / 2oz

Inner copper weight

Manufacturing Capabilities: 0.5oz / 1oz / 2oz

Notes: Finished copper weight of inner layer could be 0.5oz / 1oz / 2oz

Surface finish

Manufacturing Capabilities: HASL / Lead-free HASL / ENIG / OSP

HDI structure

Manufacturing Capabilities: Type 1 / Type 2 / Type 3

Notes: Mechanical blind/buried vias or laser blind/buried vias (electroplating via-filling available) or laser blind vias with filling dimple ≤ 15µm

Electrical test

Manufacturing Capabilities: Flying probe / special test fixture

Notes: No limits for flying probe testing; max. 14,000 pads can be tested by PCB test fixture

Beveling angle of gold finger

Manufacturing Capabilities: 20° / 30° / 45° / 60°

Beveling angle tolerance of gold finger

Manufacturing Capabilities: ±5°

Beveling depth tolerance of gold finger

Manufacturing Capabilities: ±0.1mm

Outline tolerance

Manufacturing Capabilities: ±0.15mm

V-CUT angle

Manufacturing Capabilities: 30° / 45° / 60°

Number of V-CUT

Manufacturing Capabilities: ≤30 cuts

V-CUT outline size

Manufacturing Capabilities: 55mm ≤ length/width ≤ 480mm

V-CUT residue thickness

Manufacturing Capabilities: 0.25mm ≤ V-CUT residue thickness ≤ 0.4mm

Drill hole size (mechanical)

Manufacturing Capabilities: 0.15–6.5mm

Notes: Min. drill hole size 0.15mm (available for PCB thickness ≤1.2mm). Max. drilling bit diameter is 6.5mm; contact support@nextpcb.com for custom hole sizes >6.5mm

Drill hole size tolerance

Manufacturing Capabilities: ≤0.05mm

Blind / buried vias

Mechanical blind/buried vias: copper thickness ≥20µm

Laser blind/buried vias: dimple ≤10µm

Via pad size

Manufacturing Capabilities: ≥0.1mm

Notes: The pad hole size will be enlarged 0.125mm in production

PTH hole size

Manufacturing Capabilities: 0.2mm (for single side)

Notes: The annular ring size will be enlarged to 0.2mm in production

Min. non-plated holes

Manufacturing Capabilities: 0.4mm

Min. plated slots

Manufacturing Capabilities: 0.5mm

Min. non-plated slots

Manufacturing Capabilities: 0.5mm

Min. castellated holes

Manufacturing Capabilities: 0.5mm

Notes: The minimum diameter of castellated holes is 0.50mm

Hole size tolerance (plated)

Manufacturing Capabilities: ±0.075mm

Notes: e.g. if customized plated hole size is 1.000mm, the finished hole size could be between 0.925mm and 1.075mm

Hole size tolerance (non-plated)

Manufacturing Capabilities: ±0.05mm

Notes: e.g. if customized non-plated hole size is 1.000mm, the finished hole size could be between 0.95mm and 1.05mm

Rectangle hole / slot

Manufacturing Capabilities: With or without fillet angle

1oz copper

Manufacturing Capabilities: 3.5mil, single side (3.5mil ≈ 0.09mm)

2oz copper

Manufacturing Capabilities: 4.5mil, single side (4.5mil ≈ 0.11mm)

Hole to hole clearance (different nets)

Manufacturing Capabilities: ≥12mil — avoid conductive anodic filament (12mil ≈ 0.30mm)

Via to via clearance (same nets)

Manufacturing Capabilities: ≥8mil (8mil ≈ 0.20mm)

SMD pad to SMD pad clearance (pad without hole, different nets)

Manufacturing Capabilities: ≥0.15mm

Pad to pad clearance (pad with hole, different nets)

Manufacturing Capabilities: ≥0.40mm

Via to track

Manufacturing Capabilities: ≥7mil (7mil ≈ 0.18mm)

PTH to track

Manufacturing Capabilities: ≥9mil (9mil ≈ 0.23mm)

NPTH to track

Manufacturing Capabilities: ≥8mil (8mil ≈ 0.20mm)

SMD pad to track

Manufacturing Capabilities: ≥4mil (4mil ≈ 0.10mm)

Copper weight: H/HOZ (0.5oz inner layer)

Min. trace width: 2.5mil (≈0.06mm) · Min. spacing: 3mil (≈0.08mm)

Copper weight: 1oz (outer layer)

Min. trace width: 3mil (≈0.08mm) · Min. spacing: 3mil (≈0.08mm)

Copper weight: 2oz (outer layer)

Min. trace width: 5.5mil (≈0.14mm) · Min. spacing: 5.5mil (≈0.14mm)

Layer count: 1oz

Min. BGA pad dimensions: ≥0.2mm

Min. distance between BGA: 0.15mm

Min. spacing between the center of two BGAs: 0.45mm

Solder mask opening / expansion

Manufacturing Capabilities: ≥1.5mil (≈0.04mm)

Notes: A minimum 1.5mil solder mask opening should be reserved around the pad to allow for misregistration

Solder bridge

Manufacturing Capabilities: Green: 3.5mil · Black/White: 5mil · Other solder mask: 4mil

Notes: To build a solder bridge, the spacing between copper pad edges must be 3.5mil or more

Solder mask color

Manufacturing Capabilities: Green / Red / Yellow / Blue / White / Matte Black / Black

Solder mask dielectric constant

Manufacturing Capabilities: 3.5

Solder mask thickness

Manufacturing Capabilities: On base material: 0.8mil · On copper: 0.6mil

Minimum line width

Manufacturing Capabilities: Silkscreen printing ≥5mil (≈0.12mm) · Printer printing ≥3mil (≈0.08mm)

Notes: Characters with width <3mil (0.076mm) will be unidentifiable

Minimum text height

Manufacturing Capabilities: Silkscreen printing ≥30mil (≈0.76mm) · Printer printing ≥24mil (≈0.61mm)

Notes: Characters with height <24mil (0.61mm) will be unidentifiable

Character width to height ratio

Manufacturing Capabilities: ≥6:1

Notes: The preferred ratio of width to height is 6:1

Pad to silkscreen

Manufacturing Capabilities: >6mil (≈0.15mm)

Notes: The minimum distance between pad and silkscreen is 0.15mm

Trace to outline

Manufacturing Capabilities: ≥0.2mm

Notes: Individual board (routing): trace to outline ≥0.2mm

Trace to V-cut line

Manufacturing Capabilities: ≥0.4mm

Notes: Panel board with V-scoring: trace to V-cut line ≥0.4mm

Panelization without space

Manufacturing Capabilities: 0mm

Notes: No space between panelized PCBs

Panelization with space

Manufacturing Capabilities: ≥1.6mm

Notes: The space between panelized PCBs should be ≥1.6mm; otherwise the routing process may be difficult and inefficient

Panelized round board

Manufacturing Capabilities: ≥80mm×80mm

Notes: Stamp hole: hole size 0.5mm, copper gap 0.35mm, 5–7 holes per set by default

Panelized castellated holes board

Manufacturing Capabilities: Panelize with stamp holes and add tooling strips on four board edges

Notes: Distance between castellated hole and board corner should be >4mm. Recommended stamp hole diameter is 0.5–0.8mm; recommended distance between two stamp holes is 0.2–0.3mm

Min. width of breakaway tab

Manufacturing Capabilities: ≥4mm

Notes: Minimum breakaway tab width is 4mm; for breakaway with mouse-bites, minimum width is 5mm

Min. edge rails

Manufacturing Capabilities: ≥3mm

Notes: If you choose panelization by NextPCB, we add 3mm edge rails on both sides by default

PADS — copper-pour pattern

Notes: NextPCB fab uses hatch pattern by default; please confirm your copper-pour pattern when placing an order

PADS — 2D line

Notes: Valid lines cannot be placed in the corresponding layer as 2D lines; NextPCB does not process 2D lines

Altium Designer / Protel — version

Notes: Different Altium Designer versions may have missing-element issues when generating Gerber files. Please note your Altium Designer version when placing an order

Altium Designer / Protel — parts outside PCB

Notes: If components are placed far away from the PCB board, file generation may fail because the board boundary becomes too large

Altium Designer / Protel — solder mask opening

Notes: Do not place the solder mask layer opening on the paste layer by mistake — NextPCB does not process the paste layer

Altium Designer / Protel — copper-pour pattern

Notes: Excessive fill region may cause region-missing errors when generating files. Tip: choose the Polygon copper-pour pattern