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Communication HDI
Material: Fr-4
Layer Count: 6 layers
PCB Thickness: 1.0mm
Min. Trace / Space Outer: 0.075mm
Min. Drilled Hole: 0.1mm
Via Process: Tenting Vias
Surface Finish: ENIG
Product Features
Features:
1) Years of experience in half-hole production, using Da Chuan Routing machine, routing the half-hole then routing the shape, meet the strict shape requirements;
2) Minimum line width and line spacing: 0.075/0.075mm, minimum BGA pad: 0.25mm, meet customer's special needs;
3) Electroplated Copper Filling of Blind Holes by Universal DVCP(Double Track Vertical Continuous Copper Plating Equipment ) to ensure that there are no voids in the holes and quality of customer products;
4) Strict sampling inspection mode, guarantee customers' product yield.